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TOP242PN
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Approx. Rs 50 / Piece
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Product Details:
Minimum Order Quantity
100 Piece
Brand
POWER INTEGRATION
We are one of the noticeable providers of a quality grade array of Micro Chip. It integrates key components such as the controller, flash and DRAM in a single chip using a single ball grid array package (BGA) technology, breaking the traditional size restrictions, and is a great leap forward in terms of technology. In addition, its characteristics such as wide temperature (-40°C ~+85°C) and surface-mount technology (SMT) provide the most stable storage installation for observation and photography even in high altitude.
Features:
Tiny size with outstanding performance
Compliant with MO-276 standard (16x20x1.4mm)
SOC (System on chip) /SIP (System in chip) Technology
