We are one of the noticeable providers of a quality grade array of Micro Chip.
It integrates key components such as the controller, flash and DRAM in a single chip using a single ball grid array package (BGA) technology, breaking the traditional size restrictions, and is a great leap forward in terms of technology. In addition, its characteristics such as wide temperature (-40°C ~+85°C) and surface-mount technology (SMT) provide the most stable storage installation for observation and photography even in high altitude. Features:
- Tiny size with outstanding performance
- Compliant with MO-276 standard (16x20x1.4mm)
- SOC (System on chip) /SIP (System in chip) Technology